APA
Wei, . (2017). Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging. London: T&F.
Chicago
Wei, . 2017. Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging. London: T&F.
Harvard
Wei, . (2017). Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging. London: T&F.
MLA
Wei, . Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging. London: T&F. 2017.