APA
William J. Greig, . (2014). Integrated Circuit Packaging, Assembly and Interconnections. Germany: Springer.
Chicago
William J. Greig, . 2014. Integrated Circuit Packaging, Assembly and Interconnections. Germany: Springer.
Harvard
William J. Greig, . (2014). Integrated Circuit Packaging, Assembly and Interconnections. Germany: Springer.
MLA
William J. Greig, . Integrated Circuit Packaging, Assembly and Interconnections. Germany: Springer. 2014.