TY  - BOOK
AU  - Geerge Harman
TI  - Wire bonding in Micro Electronics,Ed3
SN  - 0000090986
U1  - 621.3813 
PY  - 2010///
CY  - New York
PB  - MGH
KW  -  Electronics,Ed3
KW  -  Micro
KW  -  Wire
KW  - bonding
KW  - Micro Electronics(621.3813)
ER  -