TY  - BOOK
AU  - -
TI  - Materials Developments in Microelectronic Packaging
SN  - 0000099991
U1  - 621.3813 
PY  - 1991///
CY  - Ohio
PB  - ASM
KW  -  Materials
KW  -  Microelectronic
KW  -  Packaging
KW  -  Performance
KW  -  Reliability
KW  - Developments
KW  - Micro Electronics(621.3813)
ER  -