Wei , Xing-Chang <br/><br/>
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging 

 - London  T&F  2017 
<br/><br/><label>ISBN: </label>9781315305868 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electrical <br/>Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging