TY  - BOOK
AU  - Wei , Xing-Chang
TI  - Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
SN  - 9781315305868
PY  - 2017///
CY  - London
PB  - T&F
KW  - Electrical
KW  - Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
UR  - https://www.taylorfrancis.com/books/9781315305868
ER  -