TY  - BOOK
AU  - Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif
TI  - Wafer Level 3-D ICs Process Technology
SN  - 9780387765341
PY  - 2014///
CY  - Germany
PB  - Springer
KW  - Wafer Level 3-D ICs Process Technology
UR  - http://link.springer.com/book/10.1007/978-0-387-76534-1
ER  -