TY  - BOOK
AU  - Andrew E. Perkins, Suresh K. Sitaraman
TI  - Solder Joint Reliability Prediction for Multiple Environments
SN  - 9780387793948
PY  - 2014///
CY  - Germany
PB  - Springer
KW  - Solder Joint Reliability Prediction for Multiple Environments
UR  - http://link.springer.com/book/10.1007/978-0-387-79394-8
ER  -