TY  - BOOK
AU  - Ho-Ming Tong, Yi-Shao Lai, C.P. Wong
TI  - Advanced Flip Chip Packaging
SN  - 9781441957689
PY  - 2014///
CY  - Germany
PB  - Springer
KW  - Advanced Flip Chip Packaging
UR  - http://link.springer.com/book/10.1007/978-1-4419-5768-9
ER  -