TY  - BOOK
AU  - Xingcun Colin Tong
TI  - Advanced Materials for Thermal Management of Electronic Packaging
SN  - 9781441977595
PY  - 2014///
CY  - Germany
PB  - Springer
KW  - Advanced Materials for Thermal Management of Electronic Packaging
UR  - http://link.springer.com/book/10.1007/978-1-4419-7759-5
ER  -