TY  - BOOK
AU  - Chen, Andrea
TI  - Semiconductor Packaging: Materials Interaction and Reliability
SN  - 978-1-4398-6207-0
PY  - 2011///
CY  - London
PB  - CRC
KW  - Chen, Andrea
KW  - Semiconductor Packaging: Materials Interaction and Reliability
UR  - https://www.taylorfrancis.com/books/oa-mono/10.1201/b11260/semiconductor-packaging-andrea-chen-randy-hsiao-yu-lo?context=ubx&refId=de82647e-4da7-4466-9ddf-7e45f141c701
ER  -