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1.	Image from Google Jackets	Hand Book Electronic Packaging by Edited by Harper C.A Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York M G H 1969 Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1)Call number: 621.3802 HAR. Place hold Save to lists
2.	Image from Google Jackets	Practical Guide to the Packaging of Electronics by Ali Jamnia Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York Marcel 2003 Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1)Call number: 621.381 JAM. Place hold Save to lists
3.	Image from Google Jackets	Nanopackaging by - Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York Springer 2008 Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1)Call number: 620.5 MOR. Place hold Save to lists
4.	Image from Google Jackets	Materials Developments in Microelectronic Packaging by - Material type: Text; Format: print ; Literary form: Not fiction Publication details: Ohio ASM 1991 Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1)Call number: 621.3813 SIN. Place hold Save to lists
5.	Image from Google Jackets	Nano Packaging by - Material type: Text; Format: print ; Literary form: Not fiction Publication details: Germoney Springer 2008 Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1)Call number: 620.1831 MOR. Place hold Save to lists
6.	Image from Google Jackets	Hand Book of packaging industries by Gupta Material type: Text; Format: print ; Literary form: Not fiction Publication details: Delhi Engineering Book Centre 1899 Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1). Place hold Save to lists
7.	Image from Google Jackets	KAT s Hand book on Profitable Hi-tech Palstic Indusries with India & Foriegn Machining Manufacturated by Gupta Material type: Text; Format: print ; Literary form: Not fiction Publication details: New Delhi K A T Pvt Ltd 1996 Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1). Place hold Save to lists
8.	Image from Amazon.com Image from Google Jackets	Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging by Wei , Xing-Chang Material type: Text; Format: print ; Literary form: Not fiction Publication details: London T&F 2017 Online resources: Click here to access online Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1). Found in Open Library: Place hold Save to lists
9.	Image from Amazon.com Image from Google Jackets	Practical Guide to the Packaging of Electronics by Jamnia , Ali Material type: Text; Format: print ; Literary form: Not fiction Publication details: London T&F 2016 Online resources: Click here to access online Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1). Found in Open Library: Place hold Save to lists
10.	Image from Amazon.com Image from Google Jackets	Ecosustainable Polymer Nanomaterials for Food Packaging by Silvestre , Clara Material type: Text; Format: print ; Literary form: Not fiction Publication details: London T&F 2013 Online resources: Click here to access online Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1). Found in Open Library: Place hold Save to lists
11.	Image from Amazon.com Image from Google Jackets	Food Packaging Materials by Singh , Preeti Material type: Text; Format: print ; Literary form: Not fiction Publication details: London T&F 2017 Online resources: Click here to access online Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1). Found in Open Library: Place hold Save to lists
12.	Image from Amazon.com Image from Google Jackets	Polymers for Packaging Applications by Alavi , Sajid Material type: Text; Format: print ; Literary form: Not fiction Publication details: London T&F 2014 Online resources: Click here to access online Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1). Found in Open Library: Place hold Save to lists
13.	Image from Google Jackets	Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging by E. Suhir, Y. C. Lee, C. P. Wong Material type: Text; Format: print ; Literary form: Not fiction Publication details: Germany Springer 2014 Online resources: Click here to access online Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1). Place hold Save to lists
14.	Image from Google Jackets	Integrated Circuit Packaging, Assembly and Interconnections by William J. Greig Material type: Text; Format: print ; Literary form: Not fiction Publication details: Germany Springer 2014 Online resources: Click here to access online Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1). Place hold Save to lists
15.	Image from Amazon.com Image from Google Jackets	RF and Microwave Microelectronics Packaging by Ken Kuang, Franklin Kim, Sean S. Cahill Material type: Text; Format: print ; Literary form: Not fiction Publication details: Germany Springer 2014 Online resources: Click here to access online Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1). Found in Open Library: Place hold Save to lists
16.	Image from Amazon.com Image from Google Jackets	Advanced Flip Chip Packaging by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong Material type: Text; Format: print ; Literary form: Not fiction Publication details: Germany Springer 2014 Online resources: Click here to access online Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1). Found in Open Library: Place hold Save to lists
17.	Image from Amazon.com Image from Google Jackets	Advanced Materials for Thermal Management of Electronic Packaging by Xingcun Colin Tong Material type: Text; Format: print ; Literary form: Not fiction Publication details: Germany Springer 2014 Online resources: Click here to access online Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1). Found in Open Library: Place hold Save to lists
18.	Image from Amazon.com Image from Google Jackets	Power Electronic Packaging by Yong Liu Material type: Text; Format: print ; Literary form: Not fiction Publication details: Germany Springer 2014 Online resources: Click here to access online Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1). Found in Open Library: Place hold Save to lists
19.	Image from Amazon.com Image from Google Jackets	Packaging for Sustainability by Karli Verghese, Helen Lewis, Leanne Fitzpatrick Material type: Text; Format: print ; Literary form: Not fiction Publication details: Germany Springer 2014 Online resources: Click here to access online Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1). Found in Open Library: Place hold Save to lists
20.	Image from Amazon.com Image from Google Jackets	Biscuit, Cookie And Cracker Manufacturing Manual 6: Biscuit Packaging And Storage by Duncan Manley Series: ; 6 Material type: Text; Format: print ; Literary form: Not fiction Publication details: Boston Elseiver 2002 Availability: Items available for loan: Basaveshwar Engineering College,Bagalkote (1). Found in Open Library: Place hold Save to lists