| 000 | 00591nam a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 191026s9999 xx 000 0 und d | ||
| 020 | _a9781315305868 | ||
| 100 | _aWei , Xing-Chang | ||
| 245 | 0 | _aModeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging | |
| 260 |
_aLondon _bT&F _c2017 |
||
| 536 | _aManagement | ||
| 650 | _aElectrical | ||
| 650 | _aModeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging | ||
| 856 | _uhttps://www.taylorfrancis.com/books/9781315305868 | ||
| 942 | _cE_BOOK | ||
| 999 |
_c54752 _d54752 |
||