000 00443nam a2200145Ia 4500
008 191105s9999 xx 000 0 und d
020 _a9781441957689
100 _aHo-Ming Tong, Yi-Shao Lai, C.P. Wong
245 0 _aAdvanced Flip Chip Packaging
260 _aGermany
_bSpringer
_c2014
536 _aManagement
650 _aAdvanced Flip Chip Packaging
856 _uhttp://link.springer.com/book/10.1007/978-1-4419-5768-9
942 _cE_BOOK
999 _c67410
_d67410